著者
熊谷 正芳
出版者
日本材料試験技術協会
雑誌
材料試験技術 (ISSN:02852470)
巻号頁・発行日
vol.67, no.2, pp.40-45, 2022-04-15 (Released:2023-05-15)
参考文献数
30

AbstractX-ray diffraction line profile analysis(LPA)assesses dislocation status, which is highly correlated with mechanical properties. In addition to dislocation density, a measured line profile contains information such as crystallite size, dislocation character, and dislocation arrangement parameters, which can be analyzed by the LPA. In particular, dislocation density significantly impacts metallic materials'mechanical properties, such as yield stress. Examples of research examining the relationship between its quantification and mechanical properties are presented. We also provided an example in which the dislocation structure formed by plastic deformation can be characterized by parameters other than the dislocation density.

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外部データベース (DOI)

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昨年”材料試験技術”に掲載された、熊谷先生の解説記事”X 線回折強度曲線からの機械的性質の見積もり”がJ-Stageでweb公開されました。 https://t.co/RogqGDAqm7

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