著者

川上 博士 鈴木 実平 藤原 正典 中嶋 純也

出版者

一般社団法人 溶接学会

雑誌

溶接学会論文集 (ISSN:02884771)

巻号頁・発行日

vol.25, no.1, pp.24-30, 2007 (Released:2006-12-25)

参考文献数

17

被引用文献数

2

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The possibility and the mechanical properties of Al/Cu dissimilar bonding with liquefaction by the reaction diffusion in air were investigated at the temperature range between the melting point of aluminum and the eutectic temperature of Al-Cu system equilibrium diagram. The surface of each specimen was prepared by a simple preprocessing with the polishing and the cleaning by acetone. The Al/Cu dissimilar joint could be obtained by this bonding process in air. The bonding pressure is an important factor for this bonding process. The increment of bonding temperature and the decrement of oxygen concentration of air also promote solid state diffusion at Al/Cu interface. All bonded specimens in this study were fractured by the brittle fracture mode like cleavage fracture. The phases observed mainly in fracture surface is θ phase. The tensile strength of specimen bonded in air is similar with that of specimen by the diffusion bonding in vacuum.