著者

服巻 孝 中村 満夫

出版者

一般社団法人 溶接学会

雑誌

溶接学会論文集 (ISSN:02884771)

巻号頁・発行日

vol.10, no.3, pp.337-342, 1992-08-05 (Released:2009-06-12)

参考文献数

8

被引用文献数

1 1

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Copper to copper lap joint was made by the resistance heating, applying pressure simultaneously. The copper plate was pre-soldered and the alloyed layer was pre-formed by using Pb-50Sn solder and then joint mechanism of press-soldered joints was analyzed.The reason of enhancing strength and heat resistance heated by applying voltage in press-soldered joints is summarized as follows.(1) Solder composition turns to Cu-Sn alloy composition.(2) Joint layer with higher melting point was formed in which Cu increases and Sn decreases.(3) In terms of the crystal structure, Cu3Sn, Cu6Sn5 and Cu(α) phases turns to Cu41Tn11 and Cu(α) phases which have high heat resistance.

著者

服巻 孝 中村 満夫

出版者

一般社団法人 溶接学会

雑誌

溶接学会論文集 (ISSN:02884771)

巻号頁・発行日

vol.10, no.2, pp.228-233, 1992-05-05 (Released:2009-06-12)

参考文献数

7

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Copper and some other materials were joined using the resistance heating apparatus by which heating and pressure could be applied simultaneously. The materials used were presoldered and the alloyed layer was formed on each of them by using Pb-Sn solder.Tensile test at the room temperature revealed that fracture of all specimens originated in copper material.The layers consisted mainly of Cu-Sn, Cu-Zn-Sn, Cu-Ni-Sn, Cu-Fe-Ni-Sn when copper, brass, nickel, and Fe-42Ni alloys were jointed with copper respectively.