著者

青山 拓哉 天谷 賢児 福永 明 檜山 浩國 濱田 聡美

出版者

一般社団法人 日本機械学会

雑誌

日本機械学会関東支部総会講演会講演論文集 2016.22 (ISSN:24242691)

巻号頁・発行日

pp._OS0108-1_-_OS0108-2_, 2016-03-10 (Released:2017-06-19)

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Evaporation behavior of small droplet on wafer with various film was investigated. The droplet evaporation process was categorized into two types, i.e. constant contact radius (CCR) and constant contact angle (CCA) types. In the previous research, the evaporation behavior of relatively large droplets have reported and it was confirmed that the behavior was able to predict by a simple diffusion model. In this study, the same model was applied to the small droplet. As a result, the developed model was agreed with the experimental data in the case of relatively small droplets.