著者

川村 正晃

出版者

社団法人日本材料学会

雑誌

材料 (ISSN:05145163)

巻号頁・発行日

vol.28, no.313, pp.993-996, 1979-10-15

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The objective of this study is to clarify the effect of the chemical displacement reaction between Sn-Pb solder and ZnCl_2 binary system fluxes containing fluorides or iodides as a second component on the spreadability of Sn-Pb solder. The results obtained are summarized as follows. (1) when ZnCl_2 binary system fluxes containing fluorides such as AgF, BiF_3 and NiF_2 4H_2O or iodides such as AgI, BiI_3 and NiI_2・6H_2O were used, a remarkable chemical displacement reaction between Sn-Pb solder and the fluxes took place and the spread area of the solder with these fluxes was larger than that with pure ZnCl_2 flux. (2) When ZnCl_2 binary system fluxes containing fluorides such as ZnF_2, MnF_2, KF, NaF, LiF and BaF_2 or iodides such as ZnF_2 and CdF_2 Were used, the chemical displacement reaction hardly took place and the spread area was almost the same as that with pure ZnCl_2.