著者

川村 正晃

出版者

一般社団法人日本計量史学会

雑誌

計量史研究 (ISSN:02867214)

巻号頁・発行日

vol.9, no.1, pp.26-43, 1987-12-30

著者

川村 正晃

出版者

日本科学史学会

雑誌

科学史研究 (ISSN:21887535)

巻号頁・発行日

vol.30, no.177, pp.28-30, 1991 (Released:2021-08-30)

著者

川村 正晃

出版者

日本科学史学会

雑誌

科学史研究 (ISSN:21887535)

巻号頁・発行日

vol.28, no.171, pp.129-134, 1989 (Released:2021-09-01)

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The paper describes a history of metal spraying in Japan before the Second World War. In 1916, M.U.Schoop was granted a basic patent for the metal spraying in Japan. In 1921, K.Ezawa had begun the commercialising of the metal spraying in Japan. In 1923, T.Ezawa had been granted a patent for the metal spraying used electric arc gun. In Japan, this process was used since. In spite of these successes, in 1921-1935, the metal spraying was not used extensively and a remarkable technical progress did not take place in Japan. Little attention was directed to improving the quality of the spray coated film at this stage. In the latter half of the period 1921-1945, the use of the metal spraying extended in Japan. This process made a progress with regards to both the applications in practice and the researches in laboratory. Nevertheless, the metal spraying was looked upon with some scepticism in those early days because the adhesive strength of the spray coated film to a substrate was quite small. In Japan, a real advance in the use of the metal spraying take place after the Second World War.

著者

川村 正晃

出版者

日本科学史学会

雑誌

科学史研究 (ISSN:21887535)

巻号頁・発行日

vol.26, no.163, pp.156-160, 1987 (Released:2021-09-21)

著者

川村 正晃

出版者

一般社団法人日本計量史学会

雑誌

計量史研究 (ISSN:02867214)

巻号頁・発行日

vol.8, no.1, pp.1-10, 1987-02-20

著者

川村 正晃

出版者

社団法人日本材料学会

雑誌

材料 (ISSN:05145163)

巻号頁・発行日

vol.28, no.313, pp.993-996, 1979-10-15

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The objective of this study is to clarify the effect of the chemical displacement reaction between Sn-Pb solder and ZnCl_2 binary system fluxes containing fluorides or iodides as a second component on the spreadability of Sn-Pb solder. The results obtained are summarized as follows. (1) when ZnCl_2 binary system fluxes containing fluorides such as AgF, BiF_3 and NiF_2 4H_2O or iodides such as AgI, BiI_3 and NiI_2・6H_2O were used, a remarkable chemical displacement reaction between Sn-Pb solder and the fluxes took place and the spread area of the solder with these fluxes was larger than that with pure ZnCl_2 flux. (2) When ZnCl_2 binary system fluxes containing fluorides such as ZnF_2, MnF_2, KF, NaF, LiF and BaF_2 or iodides such as ZnF_2 and CdF_2 Were used, the chemical displacement reaction hardly took place and the spread area was almost the same as that with pure ZnCl_2.