著者

冨沢 祐介 黒田 明慈 佐々木 克彦 海藤 義彦 松田 和幸

出版者

一般社団法人日本機械学会

雑誌

熱工学コンファレンス講演論文集

巻号頁・発行日

vol.2013, pp.255-256, 2013-10-18

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As smart phones become more complex, higher in performance and smaller in size, heat concentration at localized areas is becoming a problem. Therefore, the aim of this paper is to examine the effect of high thermal conductive materials for heat dissipation in order to solve this problem. The thermal conductivity of the outer case of the smart phone was changed using finite element method (FEM) to simulate high thermal conductive materials or composite materials with anisotropy. The maximum temperature gradually decreased and the minimum temperature gradually increased with increasing the thermal conductivity of the outer case. Moreover, the thermal conductivity in the longer direction of the smart phone was important for lowering the maximum temperature. In this paper, it is found that applying high thermal conductive materials to the outer case is effective for uniforming the heat dispersing.