著者

佐野 博也 杉之原 広次郎 サノ ヒロヤ スギノハラ コジロウ Hiroya SANO Kozirou SUGINOHARA

雑誌

福山大学工学部紀要

巻号頁・発行日

vol.15, pp.1-7, 1993

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Experimental investigation was made on electromagnetic noise radiated from a digital IC package on a printed circuit board with a ground plane, which simulates a multi-layer printed circuit board. We found that the principal radiation source on a printed circuit board with a ground plane is a loop composed of pins of an IC package, Vcc-pin and GND-pin, and the ground plane on the board. The loop stand out perpendicular from the board. It was also shown that the use of surface mounted devices (SMD) are effective to reduce the electromagnetic radiation from this loop. Use of a small outline package (SOP) gives radiation power 8.3 dB less than the case of a DIP package.