著者
中 庸行 山本 /和人 磯野 吉正 田中 武司 寺山 暢之
出版者
一般社団法人日本機械学会
雑誌
日本機械学会論文集. A編 (ISSN:03875008)
巻号頁・発行日
vol.66, no.644, pp.698-705, 2000-04-25
参考文献数
17
被引用文献数
2 5

This paper describes the evaluation of adhesion strength between the amorphous Silicon carbide (a-SiC) thin film, Diamond-Like Carbon (DLC)/a-SiC laminated thin film and materials used for the cutting tool. The a-SiC and DLC/a-SiC thin films were deposited on the tungsten carbide steel substrate:K10 and on the high speed steel substrate;SKH51 by Plasma-Enhanced CVD method of the hot cathode PIG discharge type. Scratch tests were carried out for examining the critical fracture load of the films. Finite Element Method (FEM) analyses were also performed to clarify the stress distribution at the interface between the films and substrates. The stress intensity factors K<SUB>I</SUB> and K<SUB>II</SUB>and the fracture toughness K<SUB>C</SUB> were calculated from results of scratch tests and FEM analyses. The K<SUB>I</SUB>, K<SUB>II</SUB>and K<SUB>C</SUB> of a-SiC and DLC/a-SiC thin films deposited on the K10 substrate were larger than those of the thin films deposited on the SKH51 substrate. The K<SUB>I</SUB>, K<SUB>II</SUB> and K<SUB>C</SUB> of both of the films were directly proportional to the density of a-SiC thin films. In turning experiments, the delamination area of DLC/a-SiC thin films deposited on the cutting tool of K10 is closely related to the K<SUB>C</SUB> obtained from the scratch tests and FEM analyses.
著者
中 庸行 磯野 吉正 田中 武司 寺山 暢之
出版者
一般社団法人日本機械学会
雑誌
日本機械学会論文集. A編 (ISSN:03875008)
巻号頁・発行日
vol.65, no.634, pp.1427-1434, 1999-06-25
参考文献数
15

This paper describes the microstructural effect of Diamond-Like Carbon (DLC) thin film on micro-tribological properties. DLC thin films with density of 1.9-2.4 g/cm<SUP>3</SUP> were deposited on Silicon (111) surface by Plasma-Enhanced CVD method of the hot cathode PIG discharge type. The effect of deposition conditions on the microstructure of DLC thin film was evaluated by Raman spectroscopy. Increasing the bias voltage and the discharge current shifted the peak of the G-band shift toward high frequency and enlarged I (D)/I (G) ratio. Pin-on-Plate friction experiments were carried out using a diamond pin in high vacuum. The friction coefficients of DLC thin films indicated constant values during the friction. The friction coefficients increased with shifting G-band toward low frequency in the range above 1540 cm<SUP>-1</SUP>, but those did not vary with increasing I (D)/I (G). The friction coefficients were directly proportional to density of the film. Molecular orbital calculations revealed that the adhesion energy on the sp<SUP>3</SUP> bonding atom cluster was higher than that on the sp<SUP>2</SUP> bonding atom cluster.
著者
中 庸行 磯野 吉正 田中 武司 寺山 暢之
出版者
一般社団法人日本機械学会
雑誌
日本機械学会論文集. A編 = Transactions of the Japan Society of Mechanical Engineers. A (ISSN:03875008)
巻号頁・発行日
vol.64, no.620, pp.1061-1068, 1998-04-25
参考文献数
19
被引用文献数
2

This paper describes the effect of density of Diamond-Like Carbon (DLC) thin film on tribological property. DLC thin films having the density of 1.9-2.5 g/cm<SUP>3</SUP> were prepared on (111) of Silicon surface by the hot cathode PIG Discharge Type Plasma-Enhanced CVD method. Ball on disk friction experiments were carried out using diamond ball. The friction coefficients increased from 0.05 to 0.20 with increasing film density in the density range below 2.185 g/cm<SUP>3</SUP>, but those did not change above 2.185 g/cm<SUP>3</SUP>. The specific wear value also increased with increasing film density. The effect of film density on tribological property between DLC thin film and diamond pin was examined by molecular dynamics simulation. The diamond pin slides to uniaxial direction on DLC thin film having the density 1.5-3.0 g/cm<SUP>3</SUP>. Atoms of DLC thin film having the density of 1.5 g/cm<SUP>3</SUP> were moved most actively. Atomic movement being like to shear deformation was observed during frictional processes. The effect of film density on friction coefficients in MD simulations was similar to that in experiments qualitatively.