著者

宮地 護 木村 義則 尾上 篤

出版者

The Laser Society of Japan

雑誌

レーザー研究 (ISSN:03870200)

巻号頁・発行日

vol.35, no.2, pp.73-78, 2007-02-15

参考文献数

9

被引用文献数

1 1

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We developed a wafer-level integration process for multiple-wavelength laser diodes. This integration process allows highly accurate and proximal alignment of emission spots, as well as high mass-productivity. Using this process, we fabricated blue/red and red/infrared two-wavelength laser diodes. In these laser diodes, the distance between two emission spots was approximately 3μm. Furthermore we fabricated blue/red/infrared three-wavelength laser diode whose emission spots were aligned within 10μm distance. Such a short spot distance allows the optical components of the pickup to be substantially simplified.