著者

李 敬鋒 川崎 亮 解 子章 渡辺 龍三

出版者

公益社団法人 日本金属学会

雑誌

日本金属学会誌 (ISSN:00214876)

巻号頁・発行日

vol.55, no.4, pp.466-471, 1991

被引用文献数

1

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A simple test method using small sized specimens is often required for the effective development of ceramic materials. In the present work, the Modified Small Punch (MSP) test was employed for evaluating the thermal shock resistance of Y<SUB>2</SUB>O<SUB>3</SUB>-ZrO<SUB>2</SUB> and SiC ceramics.<BR>The change in strength after quenching from various temperatures was evaluated accurately by the MSP test. The load vs. deflection curves obtained by the MSP test provided more detailed information about the thermal shock by quenching. It has been found that the measured values of the critical temperature difference which indicates the thermal shock resistance of the ceramics are in good agreement with the theoretically calculated values for the materials investigated in the present work. The results show that the combination of water quenching and MSP test is effective for the evaluation of thermal shock resistance of ceramics.

著者

大塚 愛子 川崎 亮 渡辺 龍三 厳 泰永

出版者

Japan Society of Powder and Powder Metallurgy

雑誌

粉体および粉末冶金 (ISSN:05328799)

巻号頁・発行日

vol.45, no.3, pp.220-224, 1998-03-15

参考文献数

7

被引用文献数

3 12

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Disk-shaped functionally graded materials of copper/alumina system have been fabricated by spark plasma sintering(SPS process. The graded layer consists of symmetrical compositional transition of Cu/Al<SUB>2</SUB>O<SUB>3</SUB>/Cu, which allows to achieve high heat conduction, electrical insulation and excellent in-plane electrical conductivity. The use of the FGMs as a compliant pad of conduction type of thermoelectric power conversion system offers high thermal energy density through the thermoelectric cell, resulting in the increase of the efficiency of thermoelectric energy conversion.<BR>This paper describes the process optimization including densification of metal-ceramic powder mixtures by SPS process, compositionally graded stacking of the mixed powders in a graphite die, the design of the compositional gradient on the basis of one dimensional heat conduction analysis and fabrication of Cu/Al<SUB>2</SUB>O<SUB>3</SUB>/Cu FGMs according to the predesigned compositional gradient.