著者

浜田 利満 仲畑 光蔵 伏見 智 森岡 喜史 西田 武彦

出版者

公益社団法人 精密工学会

雑誌

精密工学会誌 (ISSN:09120289)

巻号頁・発行日

vol.59, no.1, pp.65-71, 1993-01-05 (Released:2009-07-23)

参考文献数

15

被引用文献数

5 8

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This paper describes an automatic solder joint inspection system by X-ray imaging. The following were developed for highly reliable inspection of J-lead and gull-wing lead solder joints : (1) An automatic inspection method for double side-mounted PCBs (Printed Circuit Boards) by micro-focus X-ray imaging and board tilting, (2) Enhancement of X-ray image of solder joints by logarithmic transformation of a detected image, (3) Fillet judgement by comparison between a detected image and a number of typical nondefective images selected by a clustering procedure, (4) Bridge determination by multi-step thresholding and comparison between pattern frequency distribution of a detected image and that of a nondefective image. The inspection system developed with these technologies had a defect detection rate of 100% with the smallest detectable defect being 50 μm.