- 著者
- Ji-Hyun JANG Myoung Geun LEE Sang Uk WOO Chung Ok LEE Jin-Kyu YI Duck-Su KIM
- 出版者
- The Japanese Society for Dental Materials and Devices
- 雑誌
- Dental Materials Journal (ISSN:02874547)
- 巻号頁・発行日
- vol.35, no.4, pp.606-612, 2016-07-29 (Released:2016-07-30)
- 参考文献数
- 33
- 被引用文献数
- 33 33
This study compared the dentin bond strength of a new universal adhesive with that of contemporary multi-step dentin adhesives. Six experimental groups were prepared according to the adhesives used and their application modes: Optibond FL (OB), Adper Single Bond Plus (SB), One-Step Plus (OS), Clearfil SE Bond (CS), All-Bond Universal using etch-and-rinse mode (ABE), and AllBond Universal using self-etch mode (ABS). Micro-tensile bond strength (µTBS) and failure mode were evaluated for each group. The bonded interface was analyzed using transmission electron microscopy (TEM). As a result, µTBS of 6 experimental groups was followed as: OB=ABE=SE=ABS>SB>OS group. TEM micrographs of ABE and ABS groups revealed a homogenous adhesive layer formation. In conclusion, a new universal adhesive can make reliable bond to dentin, regardless of the application mode.