著者

井上 誠 東 泰助 小野木 伯薫 横田 勝 村田 安規 中平 敦

出版者

Japan Society of Powder and Powder Metallurgy

雑誌

粉体および粉末冶金 (ISSN:05328799)

巻号頁・発行日

vol.58, no.7, pp.407-411, 2011-07-15

参考文献数

8

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We have developed the Ag-Cu-Sn-Ni quaternary brazing filler metal having a low melting point, a high strength and a high ductility. Then, we produced wire saws composed of Ni-coated SUS304 wires, on which diamond abrasives are fixed with this brazing filler metal. We tried to slice the Si ingots using this wire saw. Good results were obtained for the application to the production of silicon wafers for solar cells. Accordingly, we focused on the basic experiments for further performance of the fixed abrasive diamond wire saws, leading to low cost of slicing technique of hard materials such as silicon and sapphire. In particular, we examined wettability, interfacial reaction and joint strength between Ag-Cu-Sn-Ni quaternary brazing filler metal and industrial metal plates such as Cu, Ni or flux coated SUS304.