著者
UCHIDA Teiji MIKAMI Osamu
出版者
一般社団法人電子情報通信学会
雑誌
IEICE transactions on electronics (ISSN:09168524)
巻号頁・発行日
vol.80, no.1, pp.81-87, 1997-01-25
参考文献数
13
被引用文献数
34

Optical surface mount technology (O-SMT), which was proposed to provide a possible solution to growing serious problems in manufacturing process of optoelectronic products, is introduced. After discussing the basic idea of O-SMT, experimental results are also described to show its feasibility.

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こんな論文どうですか? Optical Surface Mount Technology (Special Issue On Devices, Packaging Technology(UCHIDA Teijiほか),1997 … http://t.co/ZNB2dqFXdR
こんな論文どうですか? Optical Surface Mount Technology (Special Issue On Devices, Packaging Technology(UCHIDA Teijiほか),1997 http://t.co/ZNB2dqnNZJ
こんな論文どうですか? Optical Surface Mount Technology (Special Issue On Devices, Packaging Technology(UCHIDA Teijiほか),1997 http://t.co/XIZNcRYdz5
こんな論文どうですか? Optical Surface Mount Technology (Special Issue On Devices, Packaging Technology(UCHIDA Teijiほか), http://id.CiNii.jp/NfzXL
こんな論文どうですか? Optical Surface Mount Technology (Special Issue On Devices, Packaging Technology(UCHIDA Teijiほか), http://id.CiNii.jp/NfzXL

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