著者

上村 泰紀 清水 浩三 作山 誠樹

出版者

一般社団法人 スマートプロセス学会 (旧高温学会)

雑誌

スマートプロセス学会誌 (ISSN:2186702X)

巻号頁・発行日

vol.4, no.4, pp.172-178, 2015-07-20 (Released:2016-05-23)

参考文献数

11

被引用文献数

1

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In this study, effect of Ag addition on microstructure of In-48 wt%Sn solder was investigated to improve mechanical properties. The microstructure of In-Sn-Ag solder was formed by β phase, γ phase and two different intermetallic compounds (IMCs) which are Ag2In and AgIn2. Ag2In in In-Sn-Ag solder improves the mechanical strength but deteriorates the ductility. However, AgIn2 enhances the ductility but decreases the mechanical strength. To improve the both mechanical strength and ductility, control of the amount of Ag2In and AgIn2 was found to be important, and 3 wt% Ag addition was found to improve both mechanical strength and ductility of In-48 wt%Sn solder.