著者

仲田 周次

出版者

一般社団法人日本時計学会

雑誌

日本時計学会誌 (ISSN:00290416)

巻号頁・発行日

no.116, pp.38-63, 1986-03-20

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Micro joining technology is one of most important and fundamental technologies for joining, assembling the electronic devices, parts and equipments in intimate relation with assembling technology. Micro joining processes usually involve several joining processes such as ultra-sonic joining, thermo-compression joining, thermo-sonic joining, micro-soldering and so on. These joining processes are described with joining mechanism, funda-mental or some interesting phenomena and its application on assembling monolithic or hybrid integrated circuit and print circuit board. Furthermore, several assembling processes such as wire bending, TAB, Flip Chip, die bonding are given in relation with joining phenomena. Finally, several important subjects on micro joining in future technology are given with the tend of electronic parts and equipments and assembly technology.

著者

仲田 周次

出版者

The Japan Institute of Electronics Packaging

雑誌

HYBRIDS (ISSN:09142568)

巻号頁・発行日

vol.3, no.3, pp.3-21, 1987-07-01 (Released:2010-03-18)

参考文献数

23

被引用文献数

3