著者

松本 歩 髙島 憂美 岩井 優奈 八重 真治

出版者

一般社団法人 表面技術協会

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.73, no.9, pp.456-458, 2022-09-01 (Released:2022-09-03)

参考文献数

18

被引用文献数

1

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After gold recovery using silicon powder from an ammonium thiosulfate leaching solution containing copper(II)sulfate(oxidizing agent for gold dissolution), copper was also recovered. After a certain period of time, redissolution of copper occurred. Then gold was redissolved. The depletion of silicon in the solution during the recovery process leads to redissolution.