- 著者
-
松本 歩
髙島 憂美
岩井 優奈
八重 真治
- 出版者
- 一般社団法人 表面技術協会
- 雑誌
- 表面技術 (ISSN:09151869)
- 巻号頁・発行日
- vol.73, no.9, pp.456-458, 2022-09-01 (Released:2022-09-03)
- 参考文献数
- 18
- 被引用文献数
-
1
After gold recovery using silicon powder from an ammonium thiosulfate leaching solution containing copper(II)sulfate(oxidizing agent for gold dissolution), copper was also recovered. After a certain period of time, redissolution of copper occurred. Then gold was redissolved. The depletion of silicon in the solution during the recovery process leads to redissolution.