著者
松本 歩 髙島 憂美 岩井 優奈 八重 真治
出版者
一般社団法人 表面技術協会
雑誌
表面技術 (ISSN:09151869)
巻号頁・発行日
vol.73, no.9, pp.456-458, 2022-09-01 (Released:2022-09-03)
参考文献数
18
被引用文献数
1

After gold recovery using silicon powder from an ammonium thiosulfate leaching solution containing copper(II)sulfate(oxidizing agent for gold dissolution), copper was also recovered. After a certain period of time, redissolution of copper occurred. Then gold was redissolved. The depletion of silicon in the solution during the recovery process leads to redissolution.