著者

村上 光平 安達 照 弘田 実保 林 修 星之内 進

出版者

公益社団法人 精密工学会

雑誌

精密工学会誌 (ISSN:09120289)

巻号頁・発行日

vol.59, no.9, pp.1513-1518, 1993-09-05 (Released:2009-07-23)

参考文献数

5

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This paper describes the development of a new laser soldering technique for surface mount assemblies. The new technique, using a focused YAG laser beam, has a superior performance. It can be applied to TCP (Tape Carrier Package) assemblies for fine pitch leads and offers a no-bridge soldering process. In this paper, the performance of the new technique is evaluated experimentally. First, the new technique is compared with the conventional laser-soldering technique in TCP assembly. As a result, the no-bridge soldering concept is proved by the new technique. Second, to obtain more flexibility in assembly, the solder flow is investigated by a beam scanning method. The beam scanning direction is determined by the analysis of the solder flow mechanism. From these experiments, the new technique of laser soldering offers the capacity to assemble high lead counts and fine pitch ICs such as TCP.