著者

近藤 沙妃 畔田 吏 浮田 芳昭 片岡 千和 内海 裕一

出版者

The Institute of Electrical Engineers of Japan

雑誌

電気学会論文誌. C (ISSN:03854221)

巻号頁・発行日

vol.130, no.10, pp.1811-1816, 2010

---

The use of three-dimensional (3D) microstructures is becoming essential attempt to develop next generations' microdevices, to integrate many modules and various functions, and enhance the performance of device. In this paper, we present a new concept for lab on a chip using 3D structure and centrifugal force for high-throughput screening system, which has stacked multiple structures with 3D-interconnection.