- 著者
- 金子 淳一 細矢 直基 古屋 耕平
- 出版者
- 一般社団法人 日本機械学会
- 雑誌
- Dynamics & Design Conference 2010 (ISSN:24242993)
- 巻号頁・発行日
- pp._111-1_-_111-6_, 2010-09-14 (Released:2017-06-19)
- 被引用文献数
- 2 4
This paper discuses the way to reduce the noise and vibration of thin plate structures. This paper focuses on the musical saw, a kind of musical instrument. The musical saw is thin plate and it is need to bend the saw as S-curve, to play the instrument. Thin plate structures used for various products. In some case, curvature is laid on thin plate structures to enhance the rigidity. If musical saw and thin plate structures conditions are matched, it will be noise problem. Investigating that the relationship between the sound pressure, S-curve, boundary condition, and aspect ratio of the saw by experiment and FEA, it is discussed to apply the investigation result to the thin plate structures.
