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1 0 0 0 OA Retraction: Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications

著者
Maciej Patelka Noriyuki Sakai Cathy Trumble
出版者
The Japan Institute of Electronics Packaging
雑誌
Transactions of The Japan Institute of Electronics Packaging (ISSN:18833365)
巻号頁・発行日
vol.9, pp.E16-007-1-E16-007-6, 2016 (Released:2016-12-28)
参考文献数
5
This article was retracted.