著者

Terutaka TAMAI Masahiro YAMAKAWA

出版者

The Institute of Electronics, Information and Communication Engineers

雑誌

IEICE TRANSACTIONS on Electronics (ISSN:09168516)

巻号頁・発行日

vol.E100-C, no.9, pp.702-708, 2017-09-01

被引用文献数

3

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At the present time, as downsizing of connectors causes thin gold plated layer and low contact load, serious problem of degradation of contact resistance property is induced. For these contacts, corrosion of the contacts surface under environment and high temperature as soldering and reflow process should be existed. Oxidation of base metal atoms which are diffused from under layer and additives occurs. Contact resistance increases for both surface contamination and low contact load. In order to resolve these problems and wear of surface, application of contact lubricants is useful and effective. However, degradation of the lubricants under such reflow process as high temperature possibly occurs. Therefore, in this study, from view point of change of lubricant quality as viscosity, weight loss, polymerization, oxidation and molecular orientation were clarified. For increase in contact resistance, orientation of lubricant molecular acts as important factor was found. The other factors of the lubricant hardly does not effect on contact resistance.