著者

Yulin Liu Mingxing Du Jinliang Yin Chao Dong

出版者

The Institute of Electronics, Information and Communication Engineers

雑誌

IEICE Electronics Express (ISSN:13492543)

巻号頁・発行日

vol.20, no.21, pp.20230275, 2023-11-10 (Released:2023-11-10)

参考文献数

30

被引用文献数

1

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In this paper, we propose to use the junction temperature difference estimated by two temperature-sensitive electric parameters (TSEPs), threshold voltage, and p-n junction forward voltage of the IGBT module to monitor the aging of the bond wires. When the bond wires are lifted off, the chip surface temperature and the overall temperature gradient will increase, making the temperature difference measured by these two TSEPs larger. A new method is proposed in this paper to monitor the aging of the bonding wires of IGBT modules by the difference between them, and the correctness of the proposed method is verified by experiments on IGBT modules with different degrees of bonding wire aging.