- 著者
- Tiantian Zhang Ping Zhu Junjie Lian Yunchun Liu
- 出版者
- The Institute of Electronics, Information and Communication Engineers
- 雑誌
- IEICE Electronics Express (ISSN:13492543)
- 巻号頁・発行日
- vol.20, no.22, pp.20230390, 2023-11-25 (Released:2023-11-25)
- 参考文献数
- 31
The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimi-ze the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.