著者
Kota SHIBA Atsutake KOSUGE Mototsugu HAMADA Tadahiro KURODA
出版者
The Institute of Electronics, Information and Communication Engineers
雑誌
IEICE Transactions on Electronics (ISSN:09168524)
巻号頁・発行日
pp.2022CDS0001, (Released:2022-09-30)

This paper describes an in-depth analysis of crosstalk in a high-bandwidth 3D-stacked memory using a multi-hop inductive coupling interface and proposes two countermeasures. This work analyzes the crosstalk among seven stacked chips using a 3D electromagnetic (EM) simulator. The detailed analysis reveals two main crosstalk sources: concentric coils and adjacent coils. To suppress these crosstalks, this paper proposes two corresponding countermeasures: shorted coils and 8-shaped coils. The combination of these coils improves area efficiency by a factor of 4 in simulation. The proposed methods enable an area-efficient inductive coupling interface for high-bandwidth stacked memory.