著者

出島 一仁 中別府 修 中村 優斗 土屋 智洋 長坂 圭輔

出版者

一般社団法人 日本機械学会

雑誌

日本機械学会論文集 (ISSN:21879761)

巻号頁・発行日

vol.84, no.858, pp.17-00414-17-00414, 2018 (Released:2018-02-25)

参考文献数

10

被引用文献数

4

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To develop a heat flux sensor for internal combustion engines, two metal substrate thin film resistance sensors have been developed as prototypes by using MEMS (Micro-Electro-Mechanical Systems) technologies. In our previous study, a thin film heat flux sensor on a Si chip was developed for combustion fields. To apply the thin film sensor to the engine, a metal substrate sensor technology has to be developed. To begin with, a flat plate shape sensor with a SUS substrate was made in order to confirm the fabrication process and the performance of the metal substrate MEMS sensor. Heat fluxes were successfully measured in laminar premixed combustion fields, and it was confirmed that the SUS substrate flat plate shape sensor has sufficient performance in temporal resolution, measurement noise and temperature durability against requirements. Secondly, a plug shape sensor using an AC8A substrate was produced to be introduced to an engine. The heat from the sensor sidewall has to be taken into account due to the small size of the plug shape sensor, the analytical model for the heat flux calculation was extended to a two dimensional cylindrical system. Heat flux measurement tests under high load conditions with the plug shape sensor were conducted in a rapid compression and expansion machine. As a result, the sensor endured the harsh environment with the maximum pressure of 9.1 MPa and the heat flux load of 8.9 MW/m2. Furthermore, the measurement noise was estimated to 11.0 kW/m2, which was a quite low level compared with a commercially available heat flux sensor. Although the issue in the fabrication process remains, the prospects for introducing the MEMS heat flux sensor in internal combustion engine were obtained.

著者

中別府 修

出版者

社団法人 可視化情報学会

雑誌

可視化情報学会誌 (ISSN:09164731)

巻号頁・発行日

vol.23, no.90, pp.151-156_1, 2003-07-01 (Released:2009-07-31)

参考文献数

20

被引用文献数

1

著者

中別府 修 土方 邦夫 CHANDRACHOOD Madhavi LAI Jie MAJUMDAR Arun

出版者

一般社団法人日本機械学会

雑誌

日本機械学會論文集. B編 (ISSN:03875016)

巻号頁・発行日

vol.62, no.593, pp.284-290, 1996-01-25

被引用文献数

5

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A new technique, which uses the Atomic Force Microscope (AFM) coupled with a micro-thermocouple cantilever, for measurement of microscale temperature profile has been developed. Topological and thermal images of any solid sample can be obtained simultaneously by this technique. Using a handmade thin-wire thermocouple and a thin-film thermocouple deposited on a commercially available Si_3N_4 cantilever, some working small electric devices were measured in both air and vacuum. Since heat conduction through the air between the sample and the probe was dominant in air, clear but distorted thermal images were obtained. In vacuum, heat transfer through the contact point between them was so small that a signal to noise ration was low and the conventional signal amplifying technique was not helpful. The Lock-in technique was employed to detect such small signals and finally, a true temperature image of sample surface was acquired. Also, the thermal environment surrounding the cantilever in the AFM is discussed in this paper.