著者

新関 尚宏 加藤 雅彦 大杉 功 小島 勉

出版者

サレジオ工業高等専門学校

雑誌

サレジオ工業高等専門学校研究紀要 (ISSN:18812538)

巻号頁・発行日

no.33, pp.55-57, 2007

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Thin laminated devices were successfully made from alumina and PVA in the insulating interlayers in order to produce integral laminated devices more useful for reducing the contact resistance than the conventional laminated devices using the ceramic solder. The proposed process by using alumina powder enables to produce integral laminated devices more reliable than those using PVA powder because of superior insulation characteristics and stability at high temperatures. Multi-layered devices are expected to be produced from finer alumina powders using this process.