著者

三田 信

出版者

一般社団法人 日本機械学会

雑誌

日本機械学会誌 (ISSN:24242675)

巻号頁・発行日

vol.115, no.1120, pp.182, 2012-03-05 (Released:2017-06-21)

参考文献数

1

著者

安井 学 角嶋 邦之 平林 康男 三田 信 藤田 博之

出版者

一般社団法人 電気学会

雑誌

電気学会論文誌E(センサ・マイクロマシン部門誌) (ISSN:13418939)

巻号頁・発行日

vol.123, no.11, pp.477-482, 2003 (Released:2004-02-01)

参考文献数

8

被引用文献数

1 1

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This paper deals with the new method that makes micro-holes with electrodeposition photoresist (EDPR) as a sacrificial layer. The EDPR was deposited on a silicon-mold made by ICP-RIE. Ni film was plated on a silicon-mold covered with EDPR. Etched through a gap between a silicon-mold and the Ni film, the Ni film came off from the silicon-mold. As a result, we could make Ni films that have micro hole of 9.2µm in diameter, and 56µm in depth on an experimental basis, and verified the silicon-mold that lateral faces of columns did not bare scratch marks. Moreover, the circularity roundness was able to fill 1.5µm which was the specification of the printer nozzle.