- 著者
-
安井 学
角嶋 邦之
平林 康男
三田 信
藤田 博之
- 出版者
- 一般社団法人 電気学会
- 雑誌
- 電気学会論文誌E(センサ・マイクロマシン部門誌) (ISSN:13418939)
- 巻号頁・発行日
- vol.123, no.11, pp.477-482, 2003 (Released:2004-02-01)
- 参考文献数
- 8
- 被引用文献数
-
1
1
This paper deals with the new method that makes micro-holes with electrodeposition photoresist (EDPR) as a sacrificial layer. The EDPR was deposited on a silicon-mold made by ICP-RIE. Ni film was plated on a silicon-mold covered with EDPR. Etched through a gap between a silicon-mold and the Ni film, the Ni film came off from the silicon-mold. As a result, we could make Ni films that have micro hole of 9.2µm in diameter, and 56µm in depth on an experimental basis, and verified the silicon-mold that lateral faces of columns did not bare scratch marks. Moreover, the circularity roundness was able to fill 1.5µm which was the specification of the printer nozzle.