著者

齋藤 佳敬 山田 武宏 小林 正紀 榊原 純 品川 尚文 木下 一郎 秋田 弘俊 井関 健

出版者

公益社団法人 日本薬学会

雑誌

YAKUGAKU ZASSHI (ISSN:00316903)

巻号頁・発行日

vol.139, no.12, pp.1601-1608, 2019-12-01 (Released:2019-12-01)

参考文献数

20

被引用文献数

1

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Paclitaxel (PTX)-associated acute pain syndrome (P-APS) is characterized by disabling but transient arthralgia and myalgia in up to 80% of patients administered with PTX. Non-steroidal anti-inflammatory drugs (NSAIDs) are widely administered to patients with cancer who have pain or fever, and are mainly used to manage P-APS. In this study, we investigated how P-APS appear in the patients who were administered NSAIDs prior to PTX injection. The incidence or severity and duration of P-APS in patients previously administered NSAIDs were compared to those of patients who were not administered NSAIDs. The relationship between previously administered NSAIDs and rescue administration for the relief of P-APS was also evaluated. It was revealed that the incidence and duration of P-APS were 72% and 4.67±2.30 d, respectively, in the control group and 84% and 6.19±3.30 d, respectively, in the NSAIDs group. There was no significant difference in the incidence and duration and the severity of P-APS between the two groups. Patients who were previously administered NSAIDs tended to obtain less pain relief from NSAIDs administered as rescue medications, and needed other medication. Univariate and multivariate analysis revealed no correlation between previously administered NSAIDs or patient characteristics and the incidence of P-APS. In this study, it was found that clinical condition that needs NSAIDs and previously administered NSAIDs prior to PTX injection do not affect the incidence, severity, and duration of P-APS. These results will help in educating patients about their medications and will contribute to the management of P-APS.

著者

榊原 純哉

出版者

合成樹脂工業協会

雑誌

熱硬化性樹脂 (ISSN:03884384)

巻号頁・発行日

vol.7, no.4, pp.208-220, 1986-12-10 (Released:2012-08-20)

参考文献数

28

被引用文献数

1

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プラスチックは第2次世界大戦後飛躍的に伸び, 世界の経済成長の一翼を担ってきた。そのなかで, 熱硬化性樹脂はプラスチック全生産量の約20%を占め, その優れた耐熱性, 電気絶縁性, 加工の容易さ等の特徴が活用され, 多様な製品形態で日本の産業発展に大きく寄与してきた。特に熱硬化性樹脂は, 日本経済をリードするエレクトロニクス産業を中心とする先端技術分野において重要な役割を演じてきている。熱硬化性樹脂の用途及びプリント配線基板, 半導体封止材料を主体としたエレクトロニクス産業における熱硬化性樹脂の応用と技術動向について概説した。さらに, 最近の新しい樹脂及び応用について述べ, 熱硬化性樹脂の今後の展開方向について言及した。