文献一覧: 一般社団法人表面技術協会 (出版者)

3 0 0 0 OA 機能水利用洗浄技術とモノづくり

著者: 二ツ木高志
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.60, no.2, pp.98, 2009-02-01 (Released:2009-10-09)
参考文献数: 8
被引用文献数: 2

2019-03-27 19:21:13
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3 0 0 0 OA 電子けがき用塗料

著者: 今田武士
出版者: 一般社団法人表面技術協会
雑誌: 実務表面技術 (ISSN:03682358)
巻号頁・発行日: vol.30, no.5, pp.208-212, 1983-05-01 (Released:2009-10-30)
参考文献数: 7

2019-03-03 01:40:32
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3 0 0 0 OA ホウ砂とカーボランダムの熱浴による軟鋼表面の浸ホウ硬化処理の研究

著者: 吉岡正三山本久熊谷雅晴
出版者: 一般社団法人表面技術協会
雑誌: 金属表面技術 (ISSN:00260614)
巻号頁・発行日: vol.21, no.5, pp.272-276, 1970-05-01 (Released:2009-10-30)
参考文献数: 5
被引用文献数: 3 1

A simple and economical process for boriding metal surfaces was found. The process was only to immerse the metal in a hot salt bath containing borax and carborundum, where no special atmosphere was needed.Optimum conditions found for boriding of mild steel were to dip the steel in a bath containing 60-50wt% of borax and 40-50wt% of carborundum at 1, 000°C for 6hrs. The boride layer produced by this process was composed of Fe2B, which was 170μ in thickness, having about 1, 200 of Vickers hardness.The mild steel lying beneath the boride layer was also observed hardened. The results of chemical analysis and electron probe microanalysis showed that the hardening of the interior mild steel was attributed to the boron and carbon penetrating through the boride layer.

2019-02-28 14:25:33
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3 0 0 0 OA 硫酸銅溶液中での鉄に対する銅の化学置換メッキ

著者: 尾形幹夫
出版者: 一般社団法人表面技術協会
雑誌: 金属表面技術 (ISSN:00260614)
巻号頁・発行日: vol.26, no.12, pp.592-596, 1975-12-01 (Released:2009-10-30)
参考文献数: 5
被引用文献数: 1

Experiments were carried out to find the mechanism of galvanic displacement: Fe+Cu2+→Fe2++Cu. When iron is immersed in a concentrated copper sulfate solution, e.g., 0.5M, a poorly adherent copper is deposited. In this case FeSO4 or Fe2O3 coprecipitated with the copper because the concentration of Fe2+ near the interface increased rapidly immediately after the immersion. However, atyell adherent copper was deposited by immersion in an acidic dilute copper sulfate solution, e.g., 0.01M, pH 1.5. In this case the rate of copper deposition, namely, the rate of formation of Fe2+ was slow, so that the Fe2+ was permitted to diffuse into the bulk of the solution without precipitating, which was the case of well adherent copper plate. The formulation of immersion plating of copper on iron was: CuSO4 0.0025-0.03M, pH<2.5, room temperature, immersion time 0.5-15min. The copper plating applied under these conditions was adherent to iron, hence copper could be electroplated on it from the ordinary pyrophosphate baths.