文献一覧: 表面技術 (雑誌)

1 0 0 0 OA 合金めっきの基本と実用

著者: 森河務
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.72, no.11, pp.576-585, 2021-11-01 (Released:2022-05-01)
参考文献数: 24
被引用文献数: 1

2022-08-12 01:20:45
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1 0 0 0 OA めっき現場でのトラブルとその対策

著者: 星野芳明
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.65, no.7, pp.294-303, 2014-07-01 (Released:2015-07-01)
被引用文献数: 3 2

2022-08-12 01:16:55
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1 0 0 0 OA 非シアン銀めっき浴の可能性に関する研究

著者: 井上博之山川宏二近藤哲也正木征史
出版者: The Surface Finishing Society of Japan
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.41, no.11, pp.1178-1180, 1990-11-01 (Released:2009-10-30)
参考文献数: 8
被引用文献数: 2 4

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit dose not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silvercyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating.However, consideration of the difference between the values of the stability constants for the silver-iodide complex and for the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in silver-potassium iodide solutions, might be comparatively low. To confirm this, the rate of replacement deposition of silver in a silver-potassium iodide solution (AgNO3 0.10mol/L, KI 2.00mol/L) and in a strike silver plating bath (AgCN 0.028mol/L, KCN 1.15mol/L) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

2022-08-08 19:27:56
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1 0 0 0 OA レーザクリーニングとその応用

著者: 日野実橋本嘉昭水戸岡豊
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.69, no.10, pp.435-440, 2018-10-01 (Released:2019-04-01)
参考文献数: 21
被引用文献数: 1 1

2022-08-01 13:42:11
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1 0 0 0 OA 半導体ウエハへの三次元配線加工:TSVと狭ピッチ電極を中心に

著者: 福島誉史李康旭田中徹小柳光正
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.67, no.8, pp.414-420, 2016-08-01 (Released:2017-08-01)
参考文献数: 51
被引用文献数: 1 1

2022-07-08 03:41:32
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1 0 0 0 OA 水素を貯める水素貯蔵材料としての水素化ホウ素ナトリウム

著者: 須田精二郎李洲鵬森ケ崎信人劉賓虹孫元明内田雅樹
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.56, no.4, pp.194, 2005 (Released:2005-11-24)

2022-07-04 09:26:41
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1 0 0 0 OA 溶融塩/イオン液体からのアルミニウム電析

著者: 上田幹人津田哲哉
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.71, no.12, pp.729-733, 2020-12-01 (Released:2021-06-01)
参考文献数: 35

2022-05-09 17:09:13
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1 0 0 0 OA 環境負荷の低い有機酸溶液によるSUS304鋼電解研磨面の不働態化処理

著者: 石見清隆井田義明津高文幸杉本克久
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.67, no.3, pp.150-158, 2016-03-01 (Released:2017-03-01)
参考文献数: 12
被引用文献数: 1 2

Anodic polarization curves of electro-polished Type 304 stainless steel were measured in organic acid solutions of eight types to develop a safe and environmentally friendly passivation treatment. The pitting potentials of the steel passivated in the solutions were examined in a deaerated 3.5%NaCl solution. Among the organic acid solutions, 8%DL-malic acid, 8%citric acid, 8%L-tartaric acid and 8%glucono-δ-lactone were found to be suitable as treatment solutions because of the low current densities(<0.02 A・m-2)of the passive state and high pitting potentials(>700 mV vs. Ag/AgCl(sat. KCl))of the passive films. Passive films formed on Type 304 stainless steel by natural immersion into 8%DL-malic acid+0.98%H2O2, 8%citric acid+0.98%H2O2, 8%L-tartaric acid+0.98%H2O2 and 8%glucono-δ-lactone+0.98%H2O2 showed high pitting potentials(>1000 mV)in NaCl solutions of 3.5% - saturation concentration. For solutions containing H2O2, the pitting-potentialraising effects were greater on an electro-polished surface than on a buffer(#400)-polished surface.

2022-04-09 00:24:37
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1 0 0 0 OA 先端半導体洗浄技術の課題と展望

著者: 服部毅
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.59, no.8, pp.526, 2008 (Released:2009-03-25)
参考文献数: 16
被引用文献数: 5 4

2022-03-27 13:11:10
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1 0 0 0 OA 高飽和磁束密度を有する軟磁性めっき膜

著者: 逢坂哲彌横島時彦
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.61, no.6, pp.402, 2010-06-01 (Released:2010-12-25)
参考文献数: 39

2022-03-12 16:16:00
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1 0 0 0 OA 薄膜磁気ヘッドにおける微細加工技術

著者: 篠浦治小柳勤
出版者: The Surface Finishing Society of Japan
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.46, no.9, pp.798-803, 1995-09-01 (Released:2009-10-30)
参考文献数: 30

2022-03-12 16:02:00
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1 0 0 0 OA PVDの最新動向

著者: 小島啓安
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.68, no.12, pp.654-661, 2017-12-01 (Released:2018-10-01)
参考文献数: 26
被引用文献数: 1 1

2022-03-11 21:13:00
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1 0 0 0 OA 変則高周波交流電気分解による水素・酸素ナノバブルの生成

著者: 尾形幹夫
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.69, no.4, pp.163-165, 2018-04-01 (Released:2018-12-01)
参考文献数: 15

Hydrogen・oxygen nanobubbles were generated in 0.1-1.0 m mol/L Na2SO4 solutions using anomalous high-frequency AC electrolysis (-pole and ±poles, 30 kHz). The bubble size distribution was 20-600 nm. The maximum bubble number density was about 4 million per milliliter at the size distribution position of 100 nm. The bubble number density of the solution boiled for 2 min did not decrease, but instead increased slightly. After 26 days, the nanobubbles were found to exist almost stably.

2022-03-09 22:08:17
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1 0 0 0 OA Ni-P電気めっき皮膜の硬さに対するサッカリンナトリウム添加の影響

著者: 佐伯功木村豪志春木佳奈佐藤忠夫
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.62, no.12, pp.717, 2011 (Released:2012-09-22)
参考文献数: 13

This study examined Ni-P electroplating with saccharin sodium salt. Hardness of the deposited films increased concomitantly with increasing concentration of the saccharin sodium salt in the plating bath. It reached Hvm = 822 at the concentration of 8.3 mol m−3. Crystallites in the films were too small to account for film hardening by the Hall-Petch mechanism.

2022-02-26 21:09:53
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1 0 0 0 OA フェムト秒レーザーによる表面微細構造形成

著者: 加藤貴行阿部信行
出版者: 一般社団法人表面技術協会
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.60, no.11, pp.716, 2009-11-01 (Released:2010-05-28)
参考文献数: 12
被引用文献数: 1 1

2022-02-13 22:43:24
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1 0 0 0 OA Ni-金属Sn複合めっき皮膜の作製とそのはんだ付け性

著者: 伊崎昌伸榎本英彦小見崇
出版者: The Surface Finishing Society of Japan
雑誌: 表面技術 (ISSN:09151869)
巻号頁・発行日: vol.42, no.5, pp.553-558, 1991-05-01 (Released:2009-10-30)
参考文献数: 12

The relationship between solderability and the structure of Ni-metallic Sn composites electroplated from Watts Ni baths, with and without brightener, were studied by scanning electron microscopy, energy dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy. Solderability was evaluated by measurement of the spread of Sn-Pb alloy particles placed on composites kept at 240C for 5 seconds. The Sn content of composites plated with brightener was increased to 18wt% with only 1g/L of Sn particles in the bath, but the Sn content of composites plated without brightener was increased to 22wt% with 2g/L of Sn in the bath. Composites plated with brightener showed poor solderability irrespective of the Sn content, but the solderability of composites plated without brightener was excellent and increased linearly with increases in their Sn content. The differences in solderability were found to be the result of differences in the coverage of Ni on composite surfaces. Irrespective of the presence or absence of brightener, the surfaces of the codeposited Sn particles were covered with a thin film of Sn oxide. In the presence of brightener, a large part of the surface of the Sn particles was covered with deposited Ni, while in the absence of brightener, coverage of the Sn with Ni was negligible, leading to good solderability.