著者
照井 充 福田 勇夫 加藤 明彦 藤城 恒夫 周 立波 江田 弘
出版者
一般社団法人日本機械学会
雑誌
茨城講演会講演論文集 : Ibaraki district conference
巻号頁・発行日
vol.2001, pp.99-100, 2001-09-20

It is experimentally known that the insert tools significantly change in their cutting performances when being subject to an electric field. For example, electrically/magnetically treated inserts show mach longer tool life (average 2 times) than those untreated. This research takes the first step to develop a very low cost system for electrical/magnetic insert treatment, and systematically investigate the electrical effects on the tool performance. A series of cutting tests have been executed to compare the tool performances between the treated/untreated tools. The tool performance has been evaluated from viewpoint of magnetic flux distribution, hardness and flank wear. The ultimate results lead to an analytical conclusion and a principle for tool performance optimization.
著者
蛯名 雄太郎 前崎 智博 周 立波 清水 淳 小貫 哲平 尾嶌 裕隆 乾 正知
出版者
公益社団法人 精密工学会
雑誌
精密工学会誌 (ISSN:09120289)
巻号頁・発行日
vol.84, no.7, pp.640-645, 2018-07-05 (Released:2018-07-05)
参考文献数
16

The grinding wheel is comprised by three elements; abrasive grain, bonding material and pore, which are specified by five factors; type of abrasive grain, grain size, type of bonding material, grade of hardness and abrasive grain volume percentage. Regarding the abrasive grain, it is well known that shape and number of cutting edge significantly effects grinding performance such as surface roughness, grinding force and grinding wheel life. In general, abrasive grain size is determined by mean diameter of abrasive grain. However, the abrasive grains in a grinding wheel are randomly scraggly in size and shape. There is no particular aspect to regulate the grain size variation in JIS (Japanese Industrial Standards). This paper investigates the effect of grain size variation on the ground surface topography by actual grinding on silicon wafers and analysis based on grinding simulation. The results reveal that the standard deviation of grain size is a very important index to characterize the grinding performance of a wheel. Smaller standard deviation leads to larger density of effective cutting-edge under the same volume percentage of abrasive grain contained in the wheel. This fact significantly contributes to not only achieve a better surface roughness and more uniform surface integrity, but also shorten the finishing time.
著者
周 立波 清水 淳 尾嶌 裕隆 山本 武幸 江田 弘 神谷 純生 岩瀬 久雄 山下 輝樹 田代 芳章 田 業氷
出版者
茨城大学
雑誌
基盤研究(B)
巻号頁・発行日
2007

本研究は,超高速光通信用可変分散補償器のコア要素である単結晶Siエタロンの加工技術を確立することを目的に,独自に開発したSiと化学反応するCMG加工技術を用いて,大口径Siウエハを高精度・高品位に加工できるOne-stop加工システムを開発し,CMG砥石およびプロセスの最適化を行い,固定砥粒加工だけでGBIR<0.3μm,加工変質層のない15μmの極薄Siウエハを実現した.