著者

新井 進 竹本 正 水谷 正海 征矢 隆

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.44, no.1, pp.50-54, 1993-01-01 (Released:2009-10-30)

参考文献数

16

---

It is known that oxides of copper, nickel, tin, etc. are reduced in hydrogen atmosphere at soldering temperature. In expectation of this hydrogen reduction effect, dull nickel electrodeposits were formed under excess current density to obtain nickel films containing hydrogen and their solderability was measured by meniscograph. The hydrogen content of the nickel electrodeposits, and their crystal structure, composition and morphology were analyzed and correlations between these parameters and solderability investigated.The results are summarized as follows.(1) Nickel electrodeposits formed under excess current density showed a marked improvement in solderability.(2) The crystal structure of the nickel electrodeposits was fcc and the preferential orientation changed with current density, but no correlation was found between solderability and orientation.(3) There was good correlation between the solderability of the nickel electrodeposits and their hydrogen content.

著者

新井 進

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.43, no.11, pp.1079-1080, 1992-11-01 (Released:2009-10-30)

参考文献数

9

被引用文献数

4 1

著者

藤田 玲子

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.49, no.4, pp.356-360, 1998-04-01 (Released:2009-10-30)

参考文献数

18

被引用文献数

1 1

著者

井上 博之 山川 宏二 近藤 哲也 正木 征史

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.41, no.11, pp.1178-1180, 1990-11-01 (Released:2009-10-30)

参考文献数

8

被引用文献数

2 4

---

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit dose not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silvercyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating.However, consideration of the difference between the values of the stability constants for the silver-iodide complex and for the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in silver-potassium iodide solutions, might be comparatively low. To confirm this, the rate of replacement deposition of silver in a silver-potassium iodide solution (AgNO3 0.10mol/L, KI 2.00mol/L) and in a strike silver plating bath (AgCN 0.028mol/L, KCN 1.15mol/L) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

著者

篠浦 治 小柳 勤

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.46, no.9, pp.798-803, 1995-09-01 (Released:2009-10-30)

参考文献数

30

著者

伊崎 昌伸 榎本 英彦 小見 崇

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.42, no.5, pp.553-558, 1991-05-01 (Released:2009-10-30)

参考文献数

12

---

The relationship between solderability and the structure of Ni-metallic Sn composites electroplated from Watts Ni baths, with and without brightener, were studied by scanning electron microscopy, energy dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy. Solderability was evaluated by measurement of the spread of Sn-Pb alloy particles placed on composites kept at 240C for 5 seconds. The Sn content of composites plated with brightener was increased to 18wt% with only 1g/L of Sn particles in the bath, but the Sn content of composites plated without brightener was increased to 22wt% with 2g/L of Sn in the bath. Composites plated with brightener showed poor solderability irrespective of the Sn content, but the solderability of composites plated without brightener was excellent and increased linearly with increases in their Sn content. The differences in solderability were found to be the result of differences in the coverage of Ni on composite surfaces. Irrespective of the presence or absence of brightener, the surfaces of the codeposited Sn particles were covered with a thin film of Sn oxide. In the presence of brightener, a large part of the surface of the Sn particles was covered with deposited Ni, while in the absence of brightener, coverage of the Sn with Ni was negligible, leading to good solderability.

著者

大津 陽

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.42, no.1, pp.2-12, 1991-01-01 (Released:2009-10-30)

参考文献数

5

被引用文献数

2 1

著者

高桑 一雄

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 = The Journal of the Surface Finishing Society of Japan (ISSN:09151869)

巻号頁・発行日

vol.49, no.11, pp.1185-1191, 1998-11-01

著者

中村 憲二

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.49, no.12, pp.1262-1265, 1998-12-01 (Released:2009-10-30)

参考文献数

3

著者

堀切 靖晃

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.48, no.4, pp.409-412, 1997-04-01 (Released:2009-10-30)

参考文献数

3

被引用文献数

2 2

著者

井上 孝 吉成 正雄 鮎川 保則 田中 輝男 下野 正基

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.49, no.7, pp.682-689, 1998-07-01 (Released:2009-10-30)

参考文献数

51

被引用文献数

4

著者

笹田 直

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.48, no.3, pp.271-276, 1997-03-01 (Released:2009-10-30)

参考文献数

4

被引用文献数

1 1

著者

両角 宏喜 加藤 凡典 上田 重朋

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.42, no.11, pp.1163-1168, 1991-11-01 (Released:2009-10-30)

参考文献数

5

---

The dendritic migration of copper on taped lead frames is reproduced experimentally by dipping paird lead samples in pure water (0.8MΩ, 20±3°C) and subjecting them to a DC current of about 100μA.We found several effects of alloying elements and heat treatments for samples on migration. This migration model mechanism was suggested by investigating the microscopic structure of migration dendrites and analysing other supposable factors.

著者

千葉 淳 古郡 貴志 呉 文昌

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.45, no.7, pp.735-738, 1994-07-01 (Released:2009-10-30)

参考文献数

12

被引用文献数

3 2

---

Ultrasound power was supplied with hone type at 20kHz, 400W. Process parameters studied were closed steady-state temperature, concentration, pH, sonication time and flow rate. The decomposition of dichloromethane (methylene chloride) was not affected between 300∼340K and pH 3∼9. Dilute methylene chloride in water was rapidly decomposed by ultrasonic irradiation into carbon monoxide and/or carbon dioxide, hydrochloric acid, free chlorine and water at ambient pressure. Decomposition efficiency was about 30% after 2min of sonication and about 50% after 10min of sonication at 25∼100ppm.

著者

松岡 政夫 小川 哲司 岩倉 千秋

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.42, no.9, pp.918-922, 1991-09-01 (Released:2009-10-30)

参考文献数

13

---

In recent years, electroless nickel coatings have been extensively used for various purposes in many fields of industry and a wide variety of functions have been required of the electroless nickel deposits. In this study, an electroless nickel plating bath operated at relatively low temperature has been developed, and the effects of certain factors (temperature, pH, and concentration of acetate and hypophosphite) on the deposition rate and phosphorous content of the electroless nickel deposits have been investigated in some detail. Deposits with phosphorus contents higher than 9wt% were found to be amorphous and to have improved properties with respect to tensile strength and corrosion resistance. The addition of an unsaturated compound such as maleate having a double bond will reduce the molar ratio of hydrogen gas to deposited Ni-P alloy, and also increase the phosphorus content of the deposits.

著者

芝田 隼次

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.53, no.10, pp.641-646, 2002-10-01 (Released:2009-10-30)

参考文献数

3

被引用文献数

4 7

著者

佐藤 忠夫 堀米 毅 上田 幹人

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.51, no.6, pp.640-645, 2000-06-01 (Released:2009-10-30)

参考文献数

10

被引用文献数

1

---

TiB2 and TiN films were coated by chemical vapor deposition on SKD 61 steel to improve the corrosion resistivity of a diecasting machine in a melted aluminum alloy. The protectivity of the film in the melted aluminum alloy was examined by an immersion test at 900°C and a thermal cycle test between room temperature and 900°C. TiN film, which serves as a binder, greatly improves the adhesion of TiB2 film on the steel substrate. The thermal cycle test indicated that the optimum thickness of TiB2 and TiN layers is at 4 and 6μm, respectively. Compared to ion-nitrized steel, steel coated by TiB2/TiN exhibits significantly higher degree of corrosion resistivity.

著者

渡辺 徹 中田 毅

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.45, no.11, pp.1100-1105, 1994-11-01 (Released:2009-10-30)

参考文献数

17

被引用文献数

1

著者

高柳 邦夫

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.45, no.1, pp.22-25, 1994-01-01 (Released:2009-10-30)

参考文献数

23

著者

本田 数博

出版者

The Surface Finishing Society of Japan

雑誌

表面技術 (ISSN:09151869)

巻号頁・発行日

vol.51, no.8, pp.865-867, 2000-08-01 (Released:2009-10-30)

参考文献数

6

---

Reaction of hydrogensulfite ion (HSO3-) by the dissolved oxygen (O2) in aqueous solution was remarkably enhanced under the freezing process, in which hydrogensulfite ion was changed to sulfuric ion (SO42-). When the concentration of hydrogensulfite ion was fixed at 2.0×10-4moldm-3, the time profile of pH value was reduced 6.0 to 4.5 under the freezing process, in which the change of acidity was accelerated to the later stage in freezing.